1. Preparation of the workpiece

• Degreasing: Chemically or electrolytically, until the surface is completely free of grease.
• Pickling: Conditioner to remove oxides.
• Rinsing: Rinse thoroughly with deionized or tap water to prevent acid residues from being carried into the copper bath.

2. Deposition in alkaline copper bath

• Purpose: Thin adhesion layer on the base material.
  • Conditions:
    Layer thickness only 1-3 µm (not thicker, otherwise risk of peeling increases).
  • Maintain uniform current density, better to start slightly lower.
• Rinsing: Rinse thoroughly immediately after the process.

3. Deposition in acid bright copper bath

• Transition: Transfer the workpiece to the bright copper bath after rinsing.
• Current supply:
  • Start with low current density so that the layer adheres finely and firmly.
  • Then slowly increase to normal working current density.
• Layer thickness: Can be built up as needed, decorative or functional.

Errors:

Too thick alkaline copper layer: The purpose is only to form a thin, adhesive barrier layer. A too thick layer can create stress and later flake off.

Incorrect bath parameters: Current density or voltage too high at the start in bright copper - the not yet perfectly conductive surface develops „burns“ or a disturbed crystal structure that peels off.