Copper plating solution alkaline - for acid-sensitive materials

Copper plating solution alkaline - for acid-sensitive materials

SKU: 1044
HAN: 1044

Alkaline copper plating solution for acid-sensitive metals
Suitable for bath plating and pen plating
Cyanide-free and environmentally friendly
Perfect adhesion and uniform layer thickness
Ideal for iron, zinc, copper, and other metals

Content
suitable copper anode

from

29,90 €

incl. 23% VAT , plus

This item has variations. Please select the requested variation.

Alkaline Copper Plating Solution – Ideal for Acid-Sensitive Metals

The alkaline (basic) copper plating solution is versatile and suitable for both bath plating and pen plating/tampon plating. It contains no cyanides and allows for copper plating of acid-sensitive metals such as iron and zinc.

Your Benefits:

Excellent leveling and good coverage
Intense, visually appealing color
Perfect as an intermediate layer before final coating with acidic copper plating solution or other coatings
Ideal for metals like lead, bronze, iron, copper, brass, zinc, tin, and steel

An additional layer of bright copper plating solution can enhance the color and give your workpieces a shiny finish.

Application Areas:
The alkaline copper plating solution is specially designed to prepare acid-sensitive metals for final copper plating. Iron-based materials benefit from improved adhesion, as the solution does not plate iron without current, ensuring a solid layer.

Suitable Materials:

Suitable for: Lead, bronze, iron, copper, brass, zinc, tin, steel, and zinc die-casting
Not suitable for: Aluminum, chrome, and titanium (aluminum requires pre-treatment with an aluminum activator)
Test other metals for compatibility before plating

Application Instructions:
The solution works at room temperature but can be heated up to 60°C. The ideal temperature range is between 25°C and 50°C. Thoroughly clean the workpieces to remove grease, oil, dirt, and rust. Use disposable gloves to avoid transferring skin oils to the surface.

Parameters (voltage values are indicative):

Current density: 0.2-1.5A/dm² (up to 3A/dm² with movement)
Bath plating: U ≈ 1.4 / 1.5 / 1.7 V (at 5 / 10 / 20 cm distance)
Brush plating: U ≈ 2.5-6V (approx. 4-5V recommended)
Working temperature: 20-60°C
pH value: 8-10
Immersion time: 10-45min
Deposition rate: approx. 0.4µm/min at 1A/dm² and 20°C
Anodes: Copper

Identification of the mixture:

Copper plating solution alkaline
(contains etidronic acid, potassium hydroxide, copper sulphate pentahydrate)

GHS05 GHS07 GHS09
Signal word: Danger

H290 May be corrosive to metals.
H302 Harmful if swallowed.
H314 Causes severe skin burns and eye damage.
H400 Very toxic to aquatic life.
H411 Toxic to aquatic life with long lasting effects.

P101 If medical advice is needed, have product container or label at hand.
P102 Keep out of reach of children.
P260 Do not breathe dust/vapours/spray.
P280 Wear protective gloves/protective clothing and eye protection/face protection.
P301+P330+P331 IF SWALLOWED: Rinse mouth. Do NOT induce vomiting.
P303+P361+P353 IF ON SKIN (or hair): Take off immediately all contaminated clothing. Rinse skin with water or shower.
P305+P351+P338 IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.
P310 Immediately call a POISON CENTER/doctor.
P501 Dispose of contents/container to an appropriate recycling or disposal facility.