High-quality bright copper electrolyte for shiny layers
Dr. Galva® bright copper electrolyte offers a high deposition rate and creates a shiny copper layer that requires no additional polishing. Its excellent leveling properties and even layer distribution make it ideal for thin coatings and multilayer electroplating processes. Due to its ductility, this electrolyte is particularly well-suited for fine layers.
Our bright copper electrolyte is specifically developed for all common electroplating methods – from bath plating to pen plating (brush plating). Regardless of the method, it consistently delivers high-quality results and shiny surfaces.
Applications of Electroplated Copper
Electroplated copper is often an essential component of corrosion protection systems. The copper layer produced by the bright copper electrolyte serves as a base layer for multilayer protective coatings, combined with nickel or chrome. Copper is also used in conjunction with brass as a functional intermediate layer.
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Corrosion Protection: Electroplated copper increases the corrosion resistance of surfaces.
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Conductivity: Improves the thermal and electrical conductivity of components.
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Aesthetics: Copper-coated surfaces are used as design elements in interior design and outdoor applications.
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Layering for Precious Metals: Copper serves as the foundation for gold or silver plating.
Thanks to the excellent leveling properties of the bright copper electrolyte, polishing costs are significantly reduced. Its polishability makes it an excellent choice for applications requiring smooth, uniform surfaces.
Gold and Silver Plating: Bright copper is often applied as the first layer, followed by a nickel layer as a diffusion barrier before gold or silver is applied. This barrier layer prevents copper from diffusing into the gold and discoloring the surface.
Suitable Materials for Bright Copper Electrolyte
Both alkaline and acidic copper electrolytes are suitable for various materials. However, it is important to distinguish between acid-resistant and acid-sensitive materials.
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Acid-resistant materials such as nickel, copper, brass, and bronze can be directly treated with the bright copper electrolyte.
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Acid-sensitive materials such as zinc or iron require pretreatment with alkaline copper electrolyte before applying the bright copper coating.
Surfaces made of aluminum, chrome, zinc, tin, or titanium are unsuitable for direct treatment with acidic copper electrolyte.
Achieving Optimal Results
The bright copper electrolyte is ideal for both bath plating and pen plating (brush plating). For optimal results, we recommend adhering to the correct parameters and considering the specific material requirements.
Parameters (voltage values are indicative):
- Current density: 0.6-5A/dm² (up to 7A/dm² with movement)
- Bath plating: U ≈ 0.9 / 1.5 / 2.6 V (at 5 / 10 / 20 cm distance)
- Brush plating: U ≈ 1.2-4.5V (approx. 3V recommended)
- Working temperature: 15-50°C
- pH value: 1
- Immersion time: 2-15min
- Deposition rate: approx. 1µm/min at 5A/dm² and 20°C
- Anodes: Copper
Labelling of the mixture:
Bright copper plating solution
(contains copper sulphate pentahydrate, sulphuric acid)
Signal word: Danger
H290 May be corrosive to metals.
H314 Causes severe skin burns and eye damage.
H400 Very toxic to aquatic life.
H411 Toxic to aquatic life with long lasting effects.
P101 If medical advice is needed, have product container or label at hand.
P102 Keep out of reach of children.
P234 Keep only in original packaging.
P260 Do not breathe dust/vapours/spray.
P280 Wear protective gloves/protective clothing and eye protection/face protection.
P301+P330+P331 IF SWALLOWED: Rinse mouth. Do NOT induce vomiting.
P303+P361+P353 IF ON SKIN (or hair): Take off immediately all contaminated clothing. Rinse skin with water or shower.
P305+P351+P338 IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.
P310 Immediately call a POISON CENTER/doctor.
P501 Dispose of contents/container to an appropriate recycling or disposal facility.
